Mold Temperature Analysis Method of Hot Stamping Die Based on Actual Flow Field
Abstract
A mold temperature analysis method for the hot stamping dies of complex formed parts considering the influence of different flow field distribution is proposed. First, the convective heat transfer coefficients at each node of the cooling water pipe wall were calculated by Fluent flow field analysis, and the influence of the differences in the flow field distribution caused by the water channel structure on the heat transfer capacity was considered in this process. Then, the processes of sheet forming and holding and quenching were simulated by LS-DYNA to obtain the temperature data of the blank. Finally, the A-pillar side beam was used as the research object to compare the simulation analysis results with the actual cooling effect on the hot stamping production line. The results show that the distribution of high temperature areas in the analysis result of the mold temperature based on the flow field analysis is consistent with the actual measurement. The maximum error at the 12 temperature monitoring points is 3.6 ℃，and the average error is 0.96 ℃. However, the temperature distribution and the maximum temperature difference point change in the simulation using the average heat transfer coefficient. The maximum error of the monitoring point is 9.1 ℃，and the average error is 4.96 ℃.The comparison between the simulation and experiment shows that the change of the flow rate has a significant effect on the heat transfer coefficient, and the mold temperature analysis method based on flow field analysis takes into account the effect of the differential distribution of the flow rate in the cooling channel of the hot stamping mold，which can be used for the analysis of mold temperature of complex parts and multi-cavity molds.
Keywords: hot stamping, flow fields, convective heat transfer coefficients, cooling systems, temperature distribution
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